Microelectronic devices and methods
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United States of America Patent
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Feb 12, 2008
Grant Date -
Apr 20, 2006
app pub date -
Oct 15, 2004
filing date -
Oct 15, 2004
priority date (Note) -
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Abstract
A microelectronic device is made of a semiconductor substrate, a heat generating component in a layer thereof, and a body within the remaining semiconductor substrate. The body is made of materials which have a high thermal inertia and/or thermal conductivity. When high thermal conductivity materials are used, the body acts to transfer the heat away from the substrate to a heat sink.
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