Film formation method
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United States of America Patent
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Issued Date -
Apr 20, 2006
app pub date -
Oct 19, 2005
filing date -
Oct 19, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A film formation method of forming a film on a fine-pattern by supplying a processing medium that is in the supercritical state in which a precursor is dissolved on a target substrate is disclosed. The film formation method includes a first process of supplying the processing medium on the target substrate, the temperature of which is set at a first temperature that is lower than a film formation minimum temperature that is the lowest temperature at which film formation takes place, and a second process of forming the film on the target substrate by raising the temperature of the target substrate from the first temperature to a second temperature that is higher than the film formation minimum temperature.
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