Systems, methods and slurries for chemical mechanical polishing
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United States of America Patent
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Issued Date -
Apr 20, 2006
app pub date -
Oct 20, 2004
filing date -
Oct 20, 2004
priority date (Note) -
Abandoned
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Abstract
Process, slurries formulation and polishing mechanism are disclosed for the formation of silver (Ag) or Ag alloy film features on a substrate using CMP. The process and slurries can achieve Ag or Ag alloy film features with good planarization, low roughness, high reflectivity, and low defectivity.
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