Implants and methods for treating bone
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United States of America Patent
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N/A
Issued Date -
Apr 20, 2006
app pub date -
Aug 8, 2005
filing date -
Aug 9, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
This invention relates to biomedical implants for filling, supporting or treating bone. In one embodiment, the implant comprises an electrospun polymer scaffold that is thereafter plated with a metal to provide a selected high modulus. Such an implant can be fabricated with a selected porosity for tissue ingrowth. The implant can be further provided with a varied modulus along the length of the implant body for inducing bending of the implant for packing in a bone. In another embodiment, the implant is fabricated in an elongated configuration for introducing into bone to treat a vertebral fracture. In another embodiment, the implant can be configured with helical threads for helically driving the implant into a bone.
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