Assembly and method
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United States of America Patent
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N/A
Issued Date -
Apr 27, 2006
app pub date -
Oct 25, 2004
filing date -
Oct 25, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An assembly comprises a substrate, such as a printed circuit board, with an electrically insulating layer provided thereon. The electrically insulating layer defines at least one opening, said opening being formed in a shape of an indicium relating to an aspect of the assembly.
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