Stacking system and method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
May 4, 2006
app pub date -
Dec 21, 2005
filing date -
Oct 26, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention stacks integrated circuits into modules that conserve board surface area. In a two-high stack or module devised in accordance with a preferred embodiment of the present invention, a pair of integrated circuits is stacked, with one integrated circuit above the other. The two integrated circuits are connected with a pair of flexible circuit structures. Each of the pair of flexible circuit structures is partially wrapped about a respective opposite lateral edge of the lower integrated circuit of the module. The flex circuit pair connects the upper and lower integrated circuits and provides a thermal and electrical path connection path between the module and an application environment such as a printed wiring board (PWB). The present invention may be employed to advantage in numerous configurations and combinations of integrated circuits in modules provided for high-density memories or high capacity computing.
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