Flip chip package including a heat spreader having an edge with a recessed edge portion and method of making the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Nov 3, 2004
filing date -
Nov 3, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A flip chip package generally includes a substrate, a flip chip die, and a heat spreader. The flip chip die is coupled to the substrate. The heat spreader is coupled to the flip chip die. The flip chip package can further include an encapsulate. The encapsulate can protect the flip chip die and/or other components of the flip chip package from the environment. The heat spreader can include one or more recessed edge portions to facilitate injection of the encapsulate into the flip chip package.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully