Nickel electroplating bath designed to replace monovalent copper strike solutions
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United States of America Patent
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Issued Date -
May 11, 2006
app pub date -
Nov 10, 2004
filing date -
Nov 10, 2004
priority date (Note) -
Abandoned
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Abstract
A nickel electroplating bath is disclosed which is suitable for plating, a base layer of nickel over zinc or zinc alloy parts. Subsequent plating onto this base layer can be achieved with copper, chromium or bright nickel with good adhesion and appearance. The nickel electroplating solution proposed comprises an additive package comprising (i) sulphonic acid or sulphonic acid salts, (ii) sulfonated alkoxylate and (iii) organic acid selected from the group consisting of tolylacetic acid, salicylic acid, hydroxy-benzoic acid, benzyloxyacetone and mixtures of the foregoing.
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