Sensor device
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United States of America Patent
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Feb 5, 2008
Grant Date -
May 11, 2006
app pub date -
Dec 6, 2005
filing date -
Dec 6, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A sensor device includes a sensor chip having a movable portion on one surface, a circuit chip laminated with the sensor chip to be opposite to the movable portion of the sensor chip, and a bump located between the sensor chip and the circuit chip. In the sensor device, the sensor chip and the circuit chip are electrically connected through the bump, and the movable portion of the sensor chip is separated from the circuit chip by a space using the bump. Accordingly, it can effectively restrict parasitic capacity of an electric connecting portion between both the chips from being changed by an impact. For example, the sensor device can be used as an angular velocity sensor device having a vibrator as the movable portion.
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