Apparatus for and method of bonding nano-tip using electrochemical etching
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United States of America Patent
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Nov 18, 2008
Grant Date -
May 18, 2006
app pub date -
May 26, 2005
filing date -
Nov 12, 2004
priority date (Note) -
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Abstract
Disclosed herein are an apparatus for and a method of bonding a nano-tip using electrochemical etching, in which a good bonding stability can be provided. The nano-tip bonding apparatus comprises a glass plate having a top surface of a certain desired area. An electrolytic solution having conductivity is placed on the top surface of the glass plate by means of surface tension. Means for moving reciprocally a base material having conductivity in opposite direction is provided. A carbon nano-tube is adhered to a pointed tip of the base material by means of an adhesive. An end portion of the carbon nano-tube is to be immersed in the electrolytic solution. A power supply is provided for applying an electric power to the electrolytic solution and the base material.
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