Method for inspecting a wafer
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United States of America Patent
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N/A
Issued Date -
May 18, 2006
app pub date -
Oct 19, 2005
filing date -
Nov 16, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The examination of a wafer (10) has until now been implemented by means of wafer-to-wafer comparison of the entire wafer (10). In order to ensure timely detection of defects, or the development of defects, on a wafer (10) wafer-to-wafer comparison is limited to particular comparison regions (22) selected by the user.
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