New process for preparing polyimide
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United States of America Patent
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Issued Date -
May 18, 2006
app pub date -
Jan 27, 2005
filing date -
Nov 12, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention relates to a novel process for preparing polyimide, which comprises: reacting a di-anhydride with diamine to form polyamic acid, applying or casting the polyamic acid on a substrate, evaporating the solvent contain therein to control the volatile content in the resulting polyamic acid at not more than 10 wt %, rewinding the polyamic acid-coated substrate at a tensile strength of not more than 20 kgf/cm.sup.2, transferring into an oven, heating the coated substrate at a gradient temperature to cyclize the polyamic acid into polyamide, to obtain a flexible laminate having excellent appearance in good yield. According to the present process, a polyimide flexible film having excellent properties can be produced in a low cost and a high yield.
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