Thermally integrated electronic enclosure
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United States of America Patent
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app pub date -
Jun 3, 2005
filing date -
Sep 12, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
In one aspect, the present invention provides an enclosure for an electronic device that includes a thermally conductive casing for housing internal components of the device. The casing can include a internal surface for thermal coupling to the internal components and an external surface, thermally coupled to the internal surface, for transmitting heat generated by the internal components to an external environment. In addition, the enclosure can include a heat pipe adapted for having thermal contact with at least one of the internal components at one end therefore and having thermal contact with a portion of the casing's internal surface at another end so as to facilitate transfer of heat generated by that internal component to the external environment.
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