Method and apparatus for connecting circuit cards employing a cooling technique to achieve desired temperature thresholds and card alignment
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
N/A
Issued Date -
May 25, 2006
app pub date -
Nov 1, 2005
filing date -
Nov 2, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Method and apparatus for interconnecting cards carrying heat generating ICs. A heat sink having a plurality of heat tubes is placed between two cards. The ICs are mounted 'face down' so that the heat sink engages surfaces of the ICs opposite the surfaces having electrical and heat conductive terminals wherein an interstitial layer of a non-conducting, preferably gel-like material is placed between the heat sink and the surfaces of the ICs to alleviate mechanical stresses and enhance heat transfer. The thickness of the cards made of multiple conductive layers, separated by dielectric layers are controlled to provide cards of the same thickness. The heat sink provides proper spacing between and parallelism of facing surfaces of the cards to assure reliable connection and signal integrity between high speed connectors arranged on facing surfaces of the cards to electrically connect components from one board to the other.
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