Substrate core
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United States of America Patent
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-
Jan 5, 2010
Grant Date -
Jun 1, 2006
app pub date -
May 12, 2005
filing date -
Nov 29, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A substrate including a first patterned metallic layer, a second patterned metallic layer and an insulator is provided. One side of the first patterned metallic layer is connected to a corresponding side of the second patterned metallic layer. The first patterned metallic layer and the second patterned metallic layer are formed as a whole. The insulator fills the gaps in the first patterned metallic layer and the gaps in the second patterned metallic layer.
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