Method and apparatus for testing semiconductor wafers by means of a probe card
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United States of America Patent
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N/A
Issued Date -
Jun 1, 2006
app pub date -
Jan 18, 2005
filing date -
Nov 26, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention provides a method for testing semiconductor wafers (5) by means of a probe card (7; 7', 7'a; 7''), comprising the following steps: providing a temperature-controlled chuck device (1); laying the rear side (R) of a semiconductor wafer (5) on a supporting side (AF) of the temperature-controlled chuck device (1); placing the probe card (7; 7', 7'a; 7'') on the front side (O) of the semiconductor wafer (5); impressing a current into a chip region of the front side (O) of the semiconductor wafer (5) by means of probes (91-94) of the chip card (7; 7', 7'a; 7'') placed on; and directing a focused temperature-controlled fluid jet (G) onto the front side (O) of the semiconductor wafer (5), by which means a temperature of the chip region is kept substantially at a temperature of the supporting side (AF) of the temperature-controlled chuck device (1). The present invention likewise provides a corresponding apparatus for testing semiconductor wafers (5) by means of a probe card (7).
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