Copper-plated wires for gas-shielded arc welding

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20060118537A1
SERIAL NO

11292514

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Abstract

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Disclosed herein is a copper-plated wire for gas-shielded arc welding. In the copper-plated wire, wire surface, from which a plated layer is removed, has a prominence and depression () shape on a circumference of a cross section in a direction of 90 degrees to a length of the wire, such that a ratio (dr/di) of an actual circular arcs length (dr) to an apparent circular arcs length (di) is in the range of 1.015-1.815. The wire has the prominence and depression () shape in a longitudinal direction of wire, such that a ratio (lr/li) of an actual measured length (lr) to an apparent measured length (li) is in the range of 1.015-1.515. The wire has improved surface characteristics of wire, so that adhesion between a substrate wire and a plated layer becomes excellent during copper plating on the wire surface, thereby remarkably enhancing the rust resistance and the feedability of wire in comparison to the conventional technology.

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Patent Owner(s)

Patent OwnerAddress
KISWEL LTD70 SAEBYEOK-RO 63BEON-GIL SASANG-GU BUSAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bang, Hwan Cheol Changwon, KR 6 9
Kim, Yong Chul Changwon, KR 104 651

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