Film deposition method
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United States of America Patent
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Issued Date -
Jun 8, 2006
app pub date -
Oct 17, 2005
filing date -
Oct 22, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
In a film deposition method which forms a Cu film on a Cu diffusion preventing film formed on a substrate, a contact film which is provided for adhering the Cu film to the Cu diffusion preventing film is formed on the Cu diffusion preventing film. A processing medium in which a precursor is dissolved in a medium of a supercritical state is supplied to the substrate so that the Cu film is formed on the contact film.
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