Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same
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United States of America Patent
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Issued Date -
Jun 15, 2006
app pub date -
Dec 14, 2004
filing date -
Dec 14, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A mounting substrate for a semiconductor light emitting device includes a solid metal block having first and second opposing metal faces. The first metal face includes a cavity that is configured to mount at least one semiconductor light emitting device therein, and to reflect light that is emitted by at least one semiconductor light emitting device that is mounted therein away from the cavity. One or more semiconductor light emitting devices are mounted in the cavity. A cap having an aperture is configured to matingly attach to the solid metal block adjacent the first metal face such that the aperture is aligned to the cavity. Reflective coatings, conductive traces, insulating layers, pedestals, through holes, lenses, flexible films, optical elements, phosphor, integrated circuits, optical coupling media, recesses and/or meniscus control regions also may be provided in the package. Related packaging methods also may be provided.
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