Cornerbond assembly comprising three-dimensional electronic modules
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United States of America Patent
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app pub date -
Dec 12, 2005
filing date -
Dec 4, 2003
priority date (Note) -
Abandoned
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Abstract
A device comprising the electrical interconnection of angularly disposed and abutted conductive patterns is disclosed. Conventional wire bonding equipment is used to apply a wire ball at the junction of angularly disposed conductive patterns by orienting a cornerbond assembly whereby one or more wire balls are orthogonally applied and electrically connected to the respective conductive patterns.
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