Buffer chip for a multi-rank dual inline memory module (DIMM)
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United States of America Patent
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Issued Date -
Jun 15, 2006
app pub date -
Dec 10, 2004
filing date -
Dec 10, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention refers to a buffer chip for driving external input signals applied to a multi-rank dual inline memory module (DIMM) to a predetermined number (N) of memory chips mounted on a printed circuit board of said dual inline memory module, wherein the buffer chip comprises stacked register dies each having several signal drivers, wherein at least two signal drivers are connected in parallel to drive an external input signal to said memory chips.
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