System for coupling wire to semiconductor region

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United States of America Patent

PATENT NO 7521784
SERIAL NO

11015934

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Abstract

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A first device has a surface and includes a micrometer-scale or smaller geometry doped semiconductor region extending along the surface. A second device has a surface opposite the surface of the first device and includes a micrometer-scale or smaller wire extending through the second device to a position in proximity to the surface of the second device. The first and second devices are displaceable between first and second positions relative to each other. The wire is not substantially electrically coupled to the doped semiconductor region in the first position and the wire is substantially electrically coupled to the doped semiconductor region in the second position. A potential applied to the wire affects the conductivity of the doped semiconductor region in the second position.

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Patent Owner(s)

  • HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hartwell, Peter George Sunnyvale , US 26 127
Picciotto, Carl E Menlo Park , US 39 533

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