Double-sided electronic module for hybrid smart card
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United States of America Patent
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N/A
Issued Date -
Jun 29, 2006
app pub date -
Dec 23, 2005
filing date -
Dec 28, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The invention concerns a double-sided electronic module of a hybrid contact-contactless smart card designed to be lodged in a cavity of the card and to be connected to the bonding pads of the antenna which is embedded in the card, the module including a group of contacts (52) on a first side of the support, some of the contacts each covering a through hole in the support. According to a main characteristic of the invention, on the second side of the module are screen printed first routing traces connected by their first end (55) to the through holes and by the other end to the chip's bonding pads, and second routing traces each connected respectively to a screen printed bonding pad (57 and 59) on one side and to two of the chip's bonding pads on the other side, the bonding pads being positioned so that, when inserting the module in the cavity, they are opposite the antenna's bonding pads and allow the module to be bonded along its whole periphery.
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