Ball grid array contacts with spring action
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United States of America Patent
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-
Jun 5, 2007
Grant Date -
Jun 29, 2006
app pub date -
Dec 23, 2004
filing date -
Dec 23, 2004
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electrical contact for a ball grid array connector is disclosed for providing improved solder ball connection with a substrate. The contacts may be compressed, enabling solder balls of the connector to abut with the substrate prior to reflow. During reflow, the compression may be relieved by the contact extending further into the solder ball, returning the contact to an uncompressed state.
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