Medical devices including metallic films and methods for loading and deploying same
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United States of America Patent
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Issued Date -
Jun 29, 2006
app pub date -
Dec 29, 2004
filing date -
Dec 29, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of handling an endoprosthesis includes providing an endoprosthesis having a deposited metal film with a thickness of about 50 microns or less and reducing the diameter of the endoprosthesis by sequentially collapsing different portions of the prosthesis. The collapsed endoprosthesis can be positioned with a lumen of an endoprosthesis delivery device. Different portions of the endoprosthesis can be sequentially and radially collapsed. For example, the endoprosthesis can be disposed within a hollow form of varying diameter.
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