Dual flat non-leaded semiconductor package
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United States of America Patent
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Issued Date -
Jul 6, 2006
app pub date -
Jan 5, 2005
filing date -
Jan 5, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A DFN semiconductor package includes a leadframe having a die bonding pad formed integrally with a drain lead, a gate lead and a source lead, a die coupled to the die bonding pad, a die source bonding area coupled to the source lead and a die gate bonding area coupled to the gate lead, and an encapsulant at least partially covering the die, drain lead, gate lead and source lead.
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