Thin film with MEMS probe circuits and MEMS thin film probe head using the same
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United States of America Patent
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Jun 17, 2008
Grant Date -
Jul 6, 2006
app pub date -
Dec 30, 2005
filing date -
Dec 31, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A flexible one-piece thin film with microelectro-mechanical systems (MEMS) probe circuits has a flexible non-conducting dielectric layer made from polyimide or silica, various electrical circuits arranged in multi-layered structure all embedded inside the dielectric layer, plural probes and circuit contacts protected by the dielectric layer from damage by way of one end embedded into the dielectric layer in connection with the electrical circuits respectively and the other end protruded out of the dielectric layer, and a raised probe supported-spacer disposed on the dielectric layer to form a buffer to the probes to prevent the probe from being exposed to much pressure.
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