Plasticizer for resin, and resin composition
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United States of America Patent
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Issued Date -
Jul 6, 2006
app pub date -
Jan 30, 2004
filing date -
Jan 30, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention provides a resin plasticizer comprising a compound represented by Formula (1): R.sup.1--(O--R.sup.2--CO).sub.k--O[(CHR.sup.3).sub.p(CHR.sup.4).sub.q--O]-.sub.r[(CHR.sup.5).sub.p'(CHR.sup.6).sub.q'--O].sub.r'--R.sup.7wherein R.sup.1 is a hydrogen atom or a C.sub.2-20 acyl group; R.sup.2 is a hydroxycarboxylic acid residue; each R.sup.3, R.sup.4, R.sup.5 and R.sup.6 is independently a hydrogen atom or a methyl group; R.sup.7 is a C.sub.1-8 alkyl or C.sub.2-20 acyl group; k is an integer from 1 to 60; each p, p', q and q' is an integer from 0 to 6, provided that 1.ltoreq.p+q.ltoreq.6 and 1.ltoreq.p'+q'.ltoreq.6; and each r and r' is an integer from 0 to 7, provided that 1.ltoreq.r+r'.ltoreq.7; a resin composition comprising the plasticizer; and a molded article formed from the resin composition.
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