Printed circuit boards and the like with improved signal integrity for differential signal pairs
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United States of America Patent
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N/A
Issued Date -
Jul 13, 2006
app pub date -
Nov 17, 2005
filing date -
Jan 10, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A printed circuit board with improved signal integrity for one or more differential signal pairs incorporates one or more conductive regions. In an exemplary embodiment, via structures for the differential pair that interconnect signal traces are isolated from the conductive region by an antipad area around the via structures and a conductive bridge. In alternate embodiment, an antipad area around the via structures includes a bridge between the via structures. The antipad area may comprise, by way of non-limiting example, a clipped circular aperture or a modified rectangular aperture. The bridge may, by non-limiting examples, comprise a portion of the conductive region to permit impedance tailoring of the differential pair with respect to the conductive region.
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