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United States of America Patent
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-
Jul 11, 2006
Grant Date -
Jul 13, 2006
app pub date -
Jan 20, 2006
filing date -
Aug 26, 2003
priority date (Note) -
Granted
status (Latency Note)
Importance
Abstract
An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and a substrate having a first surface in which is disposed one or more magnetic field sensing elements, with the first surface being proximate to the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit in a flip-chap arrangement. The integrated circuit includes an overcurrent circuit responsive to a voltage drop generated by a current.
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