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Abstract

A thermosetting resin composition which is improved in impact resistance, thermal crack resistance, oxidative degradation resistance and thermal degradation resistance without impairing the heat resistance represented by HDT and which is suitable for the encapsulation of semiconductors and the like, is provided. The composition is comprised by (A) a thermosetting resin; (B) any of the following mono-olefin liquid polymers (a) to (c) : wherein (a) a mono-olefin liquid polymer having as least one epoxy group (hereinafter referred to as 'epoxy group containing mono-olefin liquid polymer'), (b) a mono-olefin liquid polymer having at least one aldehyde group (hereinafter referred to as 'aldehyde group containing mono-olefin liquid polymer'), and (c) a mono-olefin liquid polymer having at least one ketone group(hereinafter referred to as 'ketone group containing mono-olefin liquid polymer')(hereinafter the polymers (a) to (c) are collectively referred to as 'reactive mono-olefin liquid polymer'); and (C) an organometallic compound and/or a metal ester compound. The composition can develop a sea-island phase structure composed of a continuous phase mainly made of a cured product of the thermosetting resin (containing a curing agent) and a dispersed phase which is mainly made of the thermosetting resin (containing a curing agent) and the reactive mono-olefin polymer wherein the whole periphery of each dispersed particle is covered with at least one interfacial phase.

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