Integrated sensor chip unit
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United States of America Patent
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app pub date -
Jan 10, 2006
filing date -
Jul 19, 2003
priority date (Note) -
Abandoned
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Abstract
The invention relates to a sensor module, in particular a measured-value pickup (2) for determining measurement data and a circuit arrangement (3) for enabling a wire-free power supply and interrogation of the measurement data. The measured-value pickup is formed as an integrable sensor (2), and the circuit arrangement is formed as an integrated semiconductor circuit module (3), the sensor (2) and the semiconductor circuit module (3) being mechanically and electrically conductively connected to one another to form an integrated sensor chip unit (1) using microsystems engineering means.
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