Inverted CSP stacking system and method
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United States of America Patent
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Dec 18, 2007
Grant Date -
Jul 20, 2006
app pub date -
Jan 20, 2005
filing date -
Jan 20, 2005
priority date (Note) -
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Abstract
Two or more integrated circuits are stacked into a high density circuit module. The lower IC is inverted. Electrical connection to the integrated circuits is made by module contacts on a flexible circuit extending along the lower portion of the module. In one embodiment, the flexible circuit provides a balanced electrical connection to two CSP integrated circuits. In another embodiment, the flexible circuit provides a balanced electrical connection to inter-flex contacts of additional flexible circuits on two submodules. The additional flexible circuits provide further balanced connections to CSP integrated circuits in each submodule.
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