Single pass, dual thickness electroplating system for head suspension components
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United States of America Patent
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Issued Date -
Jul 27, 2006
app pub date -
Jan 25, 2006
filing date -
Jan 25, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for simultaneously electroplating exposed conductor regions on both sides of a disk drive suspension component by providing an electroplating system having a bath of electroplating solution with first and second anodes in the bath. The suspension component is positioned in the bath of electroplating solution between the first and second anodes. A first electroplating current is produced between the first anode and the exposed conductor regions on the first surface of the component. A second electroplating current is produced between the second anode and the exposed conductor regions on the second surface. Layers of conductive material are thereby plated onto the exposed conductor regions on both sides of the component. By controlling parameters of the first and second plating currents, such as time and magnitude, the layers of conductive material can be plated to the same or different thicknesses on the opposite sides of the conductors.
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