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Abstract

One embodiment of the present invention is an apparatus for depositing seed layers over a substrate, said substrate includes at least one opening surrounded by a field, the apparatus includes: (a) a CVD chamber adapted to deposit a CVD seed layer over the substrate; (b) a PVD chamber adapted to deposit a PVD seed layer over the substrate; and (c) a controller which includes recipe information, said recipe information includes deposition sequence and process parameters for operation of the deposition chambers, wherein the controller, in response to the recipe information, causes first the CVD chamber to deposit a CVD seed layer over the substrate and then causes the PVD chamber to deposit a PVD seed layer over the CVD seed layer, wherein (i) at least one of the seed layers comprises a material selected from a group consisting of Cu, Ag, or alloys comprising one or more of these metals, (ii) the CVD seed layer having a thickness of less than about 200 Å over the field, (iii) the PVD seed layer having a thickness from about 100 Å to about 2,000 Å over the field, (iv) the PVD seed layer is thicker than the CVD seed layer over the field, and (v) the controller causes the stopping of the deposition of the CVD and the PVD seed layers prior to filling the at least one opening, thereby leaving enough room for electroplating inside the at least one opening.

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First Claim