Electroplating pcb components
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United States of America Patent
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N/A
Issued Date -
Aug 10, 2006
app pub date -
Mar 8, 2004
filing date -
Mar 10, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Curved out of plane metal components are formed on PCB substrates (11) by electroplating two layers (13, 14) of the same metal such that each layer has a different internal stress. This produces as curvature of the layer (13, 14) which enables coils, curved cantilever beams and springs to be fabricated. The amplitude and direction of curvature can be controlled by controlling the stress and thickness of each layer. The stress is controlled by controlling the composition of the electroplating bath.
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