High aspect ratio plated through holes in a printed circuit board
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United States of America Patent
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N/A
Issued Date -
Aug 17, 2006
app pub date -
Feb 16, 2006
filing date -
Feb 17, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The drilling and plating of high aspect ratio blind via holes in a multilayer printed circuit board are disclosed. A via hole is drilled through a sub-composite structure. The walls of the via hole are plated with a conductive material, and the hole is filled with a conductive medium. The sub-composite structure proceeds through the remainder of the processing that is necessary to manufacture the printed circuit board up to the completion of the solder mask step. The conductive medium of the via hole is drilled out to achieve a hole size that is of the desired diameter as required by the printed circuit board design.
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