Heat spreader clamping mechanism for semiconductor modules
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United States of America Patent
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app pub date -
Feb 11, 2005
filing date -
Feb 11, 2005
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Abstract
The semiconductor module includes a circuit board substrate, multiple semiconductor devices, a layer of thermal interface material, a heat spreader, and a heat spreader clamping mechanism. Each semiconductor device has a semiconductor first side coupled to the substrate, and a semiconductor second side opposing the semiconductor first side. The thermal interface material has a thermal interface material first side at least partially covering the semiconductor second side, and a thermal interface material second side opposing the thermal interface material first side. The heat spreader has a heat spreader first side contacting the thermal interface material second side, and a heat spreader second side opposing the heat spreader first side. The heat spreader clamping mechanism includes at least one clamp coupled to the heat spreader. The heat spreader clamping mechanism is configured to force the heat spreader first side against the thermal interface material with a substantially uniform pressure across all of the semiconductor devices.
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