Methods and apparatus for processing the backsides of wafers
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United States of America Patent
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N/A
Issued Date -
Aug 17, 2006
app pub date -
Oct 5, 2005
filing date -
Oct 5, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
In one aspect, a method of processing the backsides of a batch of semiconductor wafers includes receiving a cassette for wafers in its inverted orientation in which the wafers are horizontally orientated with their front faces facing downwardly, removing the wafers sequentially, or as a batch, and processing the upwardly facing backsides of the wafers. In another aspect, an apparatus for processing wafers from a cassette holding wafers horizontally includes a cassette support where the cassette support is formed to receive an industry standard cassette in its inverted position but not in its upright position.
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