Method for analyzing copper electroplating solution, apparatus for the analysis, and method for fabricating semiconductor product

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Oct 26, 2010
Grant Date
Aug 17, 2006
app pub date
Mar 23, 2004
filing date
Mar 25, 2003

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are obtained to judge the fillability with a plating solution.

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Patent Owner(s)

TOPPAN PRINTING CO., LTD.

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Naoi, Katsuyoshi	Tokyo, JP	2	13
Okubo, Toshikazu	Tokyo, JP	13	128
Yamada, Yuka	Tokyo, JP	110	1093

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Method for analyzing copper electroplating solution, apparatus for the analysis, and method for fabricating semiconductor product

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United States of America Patent

10550153

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PATENT NO	7820535
APP PUB NO	20060183257A1
SERIAL NO	10550153
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
October 26, 2010	US,7820535,B2 US7820535B2	GRANTED PATENT AS SECOND PUBLICATION
August 17, 2006	US,20060183257,A1 US20060183257A1	FIRST PUBLISHED PATENT APPLICATION

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10550153

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