Barrier layer for a processing element and a method of forming the same
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United States of America Patent
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Nov 6, 2007
Grant Date -
Aug 17, 2006
app pub date -
Mar 18, 2004
filing date -
Mar 31, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
In order to mitigate erosion of exposed processing elements in a processing system by the process and any subsequent contamination of the substrate in the processing system, processing elements exposed to the process are coated with a protective barrier. The protective barrier comprises a protective layer that is resistant to erosion by the plasma, and a bonding layer that improves the adhesion of the protective layer to the processing element to mitigate possible process contamination by failure of the protective layer.
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