Importance

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Abstract

A conformable, thermally conductive layer is provided comprising a flowable component and a plurality of substantially incompressible spacer particles, wherein the conductive layer is disposed between a pair of heat exchange surfaces of an electronic device to maintain a desired spacing during operation. The thermally conductive layer enhances heat transfer between the surfaces while the spacer layer ensures a constant desired offset between the surfaces both to maintain an optimum level of heat transfer and to provide a desired voltage standoff between the surfaces to prevent arcing across the surfaces. The offset is substantially equal to the diameter of the spacer particles, and the particles align in a single layer between the heat exchange surfaces. The heat exchange surfaces can be a heat source such as an integrated circuit chip, and the heat sink can be a plate with a plurality of fins. The flowable component can be a thermal grease or paste, and the spacer particles can be ceramic or glass material. A method of applying the conductive layer and of assembling the heat source and heat sink is also disclosed.

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First Claim