Method and apparatus for temporary thermal coupling of an electronic device to a heat sink during test

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7259580
APP PUB NO 20060186909A1
SERIAL NO

10906483

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method, system and apparatus for testing an electronic device. The method including: (a) forming a temporary liquid heat transfer layer on a surface of the electronic device; after step (a), (b) placing a surface of a heat sink into physical contact with a surface of the heat transfer layer; after step (b), (c) electrically testing the electronic device; after step (c), (d) removing the heat sink from contact with the heat transfer layer; and after step (d), (e) removing any heat transfer layer remaining on the electronic device from the surface of the electronic device.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
INTERNATIONAL BUSINESS MACHINES CORPORATIONARMONK, NY46802

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aube, Paul J Charlotte, VT 2 17
Cote, Normand Granby, CA 4 29
Gamache, Jr Roger G Essex Junction, VT 2 11
Gardell, David L Fairfax, VT 38 357
Gaschke, Paul M Wappingers Falls, NY 13 365
Knox, Marc D Hinesburg, VT 15 84
Turcotte, Denis Granby, CA 1 11

Cited Art Landscape

Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (1)
* 2002/0111,415 Thermoplastic materials with improved thermal conductivity and methods for making the same 9 2001
 
THE BOARD OF TRUSTEES OF THE LELAND STANFORD JUNIOR UNIVERSITY (1)
4567505 Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like 161 1983
 
MG TECHNOLOGIES AG (1)
* 7038065 Process for catalytically producing organic substances by partial oxidation 3 2001
 
CREDENCE, INC. (1)
* 6836131 Spray cooling and transparent cooling plate thermal management system 31 2003
 
Mobil Oil Corporation (1)
* 5053434 Diamondoid polymeric compositions 30 1990
 
GLOBALFOUNDRIES INC. (1)
* 6576996 Method for bonding heat sinks to overmolds and device formed thereby 2 2001
 
DCG SYSTEMS, INC. (1)
* 6621275 Time resolved non-invasive diagnostics system 65 2001
 
Dennison Manufacturing Company (1)
* 4548857 Heat transferable laminate 91 1984
 
STOVOKOR TECHNOLOGY LLC (1)
5170930 Liquid metal paste for thermal and electrical connections 93 1991
 
MONSANTO COMPANY (1)
* 4323533 Rotary forming of articles 30 1980
 
Delta Design, Inc. (2)
5864176 Electro-mechnical subassembly having a greatly reduced thermal resistance between two mating faces by including a film of liquid, that evaporates without leaving any residue, between the faces 22 1997
5918665 Method of thermal coupling an electronic device to a heat exchange member while said electronic device is being tested 27 1998
 
INTEL CORPORATION (1)
* 5895972 Method and apparatus for cooling the backside of a semiconductor device using an infrared transparent heat slug 73 1996
 
UNISYS CORPORATION (1)
* 6788538 Retention of heat sinks on electronic packages 17 2003
 
BASF AKTIENGESELLSCHAFT (1)
* 4507274 Desulfurization of H.sub.2 S-containing gases 13 1983
 
HENKEL IP & HOLDING GMBH (1)
6624224 Method of preparing thermally conductive compounds by liquid metal bridged particle clusters 12 2000
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (3)
8471575 Methodologies and test configurations for testing thermal interface materials 5 2010
9116200 Methodologies and test configurations for testing thermal interface materials 1 2013
* 9910085 Laminate bond strength detection 0 2016
 
GLOBALFOUNDRIES INC. (1)
8686749 Thermal interface material, test structure and method of use 1 2010
 
AIRBUS GROUP SAS (1)
* 9618567 Methods and devices for stressing an integrated circuit 0 2011
 
ADVANCED INQUIRY SYSTEMS, INC. (2)
8461024 Methods and apparatus for thinning, testing and singulating a semiconductor wafer 3 2011
8889526 Apparatus for thinning, testing and singulating a semiconductor wafer 0 2013
 
TRANSLARITY, INC. (3)
* 7453277 Apparatus for full-wafer test and burn-in mechanism 11 2007
* 2008/0074,135 Methods and apparatus for full-wafer test and burn-in mechanism 5 2007
RE46075 Full-water test and burn-in mechanism 0 2012
 
ANALOG DEVICES, INC. (2)
* 7683649 Testing system contactor 0 2007
* 2008/0116,922 Testing system contactor 5 2007
 
SENSATA TECHNOLOGIES, INC. (1)
9921265 Thermal clutch for thermal control unit and methods related thereto 0 2015
* Cited By Examiner

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