Method and system for laser hard marking
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United States of America Patent
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app pub date -
Nov 9, 2005
filing date -
Nov 11, 2004
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Abandoned
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Abstract
A method and system for laser hard marking is provided. The laser-marking system produces a hard mark on a semiconductor wafer. The system includes a pulsed laser subsystem that produces a pulsed laser output for marking at a location on the wafer. The pulsed laser subsystem is controlled so that output pulse width remains substantially constant with a variation in at least one of pulse repetition rate and output energy over a range. A beam delivery system delivers the pulsed laser output to the location on the wafer.
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