Encapsulation method for semiconductor device having center pad
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United States of America Patent
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N/A
Issued Date -
Aug 31, 2006
app pub date -
Nov 14, 2005
filing date -
Nov 13, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Apparatus and center pad die and substrate assemblies configured to provide for molding, in a single molding step, both an attached center pad die and other features on a die attach side of the substrate, and wire bonds an associated bond pads and other features on the opposite side of the substrate. Also, methods for sealing a center pad die and substrate assembly, including such a molding step.
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