Method and apparatus for detecting defects in wafers
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United States of America Patent
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Oct 12, 2010
Grant Date -
Aug 31, 2006
app pub date -
Feb 28, 2005
filing date -
Feb 28, 2005
priority date (Note) -
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Abstract
A method for inspecting a wafer including a multiplicity of dies, the method including dividing an image of at least a portion of the wafer into a plurality of sub-images each representing a sub-portion of the wafer and selecting at least one defect candidate within each sub-image by comparing each sub-image to a corresponding sub-image of a reference including a representation, which is assumed to be faultless, of the portion of the wafer.
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