Lead-free solder system
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United States of America Patent
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N/A
Issued Date -
Aug 31, 2006
app pub date -
Nov 14, 2005
filing date -
Nov 13, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A substantially lead-free solder composition having the composition (weight %): Sn, 76.0-83.9%; Ag, 8.0-12.0%; Sb, 8.0-10%; Cu, 0.1-2.0%. In some embodiments the solder composition contains 12 wt % Ag, 8 wt % Sb, 0.1 wt % Cu, the remainder being Sn. The solder can be formed into a wire, a ribbon or sheet, a solder paste or preform, or a powder, for example. Fillers, such as Si or Ag spherical fillers, with a particle size maximum at 35 .mu.m, can be added to any of the various solder forms during alloy fabrication. Also, a semiconductor package having a die attached to a support using the substantially lead-free solder composition.
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