Polishing pad for use in polishing work pieces

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20060194530A1
SERIAL NO

11067457

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A polishing/lapping pad for use in CMP and other polishing and lapping operations is presented that comprises multiple channels designed to facilitate in the manipulation of slurry into specific locations on the wafer being planarized.

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Patent Owner(s)

Patent OwnerAddress
JH RHODES COMPANY INC2800 NORTH 44TH STREET SUITE 675 PHOENIX AS 85008

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Daskiewich, Scott Benjamin Oriskany, NY 1 10
Halberg, E Dwaine Mesa, AZ 1 10
Thomson, Clifford O Mayer, AZ 2 14

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