Apparatus for manufacturing bonded substrate
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United States of America Patent
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Nov 24, 2009
Grant Date -
Sep 14, 2006
app pub date -
May 5, 2006
filing date -
Nov 30, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.
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