Wireless chip and electronic appliance having the same

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United States of America Patent

SERIAL NO

11354825

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Abstract

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The present invention provides a wireless chip having high mechanical strength. Moreover, the present invention also provides a wireless chip which can prevent an electric wave from being blocked. In a wireless chip of the present invention, a layer having a thin film transistor formed over an insulating substrate is fixed to an antenna by an anisotropic conductive adhesive, and the thin film transistor is connected to the antenna. The antenna has a dielectric layer, a first conductive layer, and a second conductive layer; the first conductive layer and the second conductive layer has the dielectric layer therebetween; the first conductive layer serves as a radiating electrode; and the second electrode serves as a ground contact body.

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Patent Owner(s)

Patent OwnerAddress
SEMICONDUCTOR ENERGY LABORATORY CO INCATSUGI-SHI 398 HASE KANAGAWA-KEN 243-0036

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arai, Yasuyuki Atsugi, JP 452 17701
Suzuki, Yukie Isehara, JP 55 1399
Yamazaki, Shunpei Setagaya, JP 7285 226486

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